SAN JOSE, Calif.--(BUSINESS WIRE)--Dec 5, 2022--
NextFlex ®, America’s Flexible Hybrid Electronics (FHE) Manufacturing Institute, today announced $8.45 million in funding (including $4.25M in cost-share contribution from participants) for nine new projects as part of its Project Call 7.0 to further promote FHE development and adoption throughout the U.S. advanced manufacturing sector.
Project Call 7.0’s awarded projects represent a diverse and innovative set of companies and universities that are jointly focused on maturing the industry’s capabilities while leveraging the strong foundation established in prior Project Calls. Several projects in this latest round of funded projects focus on advancing additive manufacturing approaches for hybrid electronics and addressing critical needs in domestic advanced semiconductor packaging capabilities, which directly aligns with the needs described in the recently passed Creating Helpful Incentives to Produce Semiconductors (CHIPS) Act.
Project Call 7.0 also focuses on using hybrid electronics manufacturing processes and materials to improve environmental sustainability in electronics manufacturing. This will include using water-based inks and lower temperature processing, as well as assessing the manufacturing reshoring of low-cost single use medical devices that utilize more environmentally sustainable manufacturing approaches and materials.
This latest round of funding brings the total amount invested in FHE developments to more than $124M, including cost share contributions from Project Call participants.
“I am pleased to announce these important new projects, which will enhance the state of the art in hybrid electronics, support national efforts for semiconductor package manufacturing, and help to transition an increasing number of new capabilities into the U.S. industrial manufacturing sector for further advancement of the industry,” said Malcolm J. Thompson, PhD, Executive Director. “The NextFlex member community is accelerating FHE and additively manufactured electronics toward commercialization in a number of critical application areas addressed in these projects.”
Project Call 7.0’s awarded funding will go to:
For more information about NextFlex and the Project Call program, please visit https://www.nextflex.us/project-call/.
About NextFlex
NextFlex is a DoD sponsored Manufacturing Innovation Institute funded by Air Force Research Laboratory Cooperative Agreement numbers FA8650-15-2-5402 and FA8650-20-2-5506. NextFlex is a consortium of companies, academic institutions, non-profits and state, local and federal governments with a shared goal of advancing U.S. manufacturing of FHE. Since its formation in 2015, NextFlex’s elite team of thought leaders, educators, problem solvers and manufacturers have come together to collectively facilitate innovation, narrow the manufacturing workforce gap and promote sustainable manufacturing ecosystems. For more information, visit www.nextflex.us and follow NextFlex on LinkedIn, Facebook and Twitter.
About Flexible Hybrid Electronics (FHE)
FHE gives everyday products the power of silicon ICs by combining them with new and unique low-cost and environmentally friendly additive printing processes and new materials. The result is fast time to market, lightweight, low-cost, and highly efficient smart products that can be flexible, conformable, and stretchable with innumerable uses for consumer, commercial and military applications. Hybrid electronics are providing PCB and heterogeneous packaging manufacturers with novel additive electronics manufacturing solutions.
View source version on businesswire.com:https://www.businesswire.com/news/home/20221205005010/en/
CONTACT: NextFlex
Karen Savala, 408-797-2219
ksavala@nextflex.usThe Hoffman Agency
Matthew Burrows, 408-975-3033
mburrows@hoffman.com
KEYWORD: UNITED STATES NORTH AMERICA CALIFORNIA
INDUSTRY KEYWORD: OTHER MANUFACTURING HARDWARE ELECTRONIC DESIGN AUTOMATION PACKAGING TECHNOLOGY AEROSPACE SEMICONDUCTOR MANUFACTURING
SOURCE: NextFlex
Copyright Business Wire 2022.
PUB: 12/05/2022 08:35 AM/DISC: 12/05/2022 08:36 AM
http://www.businesswire.com/news/home/20221205005010/en